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IDT, Integrated Device Technology Inc 72V251L15JG

IC FIFO SYNC 8KX9 10NS 32PLCC
part number has RoHS
Manufacturer # :72V251L15JG
Dasenic # :72V251L15JG-DS
Customer # :
Description : IC FIFO SYNC 8KX9 10NS 32PLCC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 46
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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72V251L15JG information

  • IDT, Integrated Device Technology Inc 72V251L15JG technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - FIFOs Memory
  • Product Status:Obsolete
  • Package / Case:32-LCC (J-Lead)
  • Functions:Synchronous
  • Series:72V
  • Operating Temperature:0°C ~ 70°C
  • Voltage- Supply:3 V ~ 3.6 V
  • Memory Size:8K x 9
  • Data Rate:66.7MHz
  • Access Time:10ns
  • F W F T Support:No
  • Expansion Type:Depth, Width
  • Bus Directional:Uni-Directional
  • Current- Supply( Max):20mA
  • Retransmit Capability:No
  • Programmable Flags Support:Yes
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
72V251L15JG provided by IDT, Integrated Device Technology Inc
Renesas Electronics Corporation (TSE: 6723) is the world's premier supplier of microcontrollers and a preferred provider of advanced semiconductor solutions. Renesas Electronics was established in November 2002 through the merger of two major Japanese semiconductor companies: Hitachi Semiconductor and Mitsubishi Electric. As a global leader in microcontrollers, analog, power, and SoC products, Renesas provides comprehensive solutions for a broad range of applications, including automotive, industrial, home electronics, office automation, and information communication technology. The company's global headquarters are located in Tokyo.Renesas Electronics has a significant global footprint, with offices, research and development centers, manufacturing facilities, and sales operations in Europe, the Middle East, Asia, and North America.
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