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1 : $1.8000
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RDI, Inc 3019L-8824-NL
8P/8C TELEPHONE JACK
Manufacturer # :3019L-8824-NL
Manufacturer :RDI, Inc
Dasenic # :3019L-8824-NL-DS
Datasheet :
3019L-8824-NL Datasheet
3019L-8824-NL DatasheetCustomer # :
Description : 8P/8C TELEPHONE JACK
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 100+ | $ 1.8000 | $ 180 |
| 300+ | $ 1.5400 | $ 462 |
| 500+ | $ 1.8000 | $ 900 |
| 1500+ | $ 1.2000 | $ 1800 |
| 2500+ | $ 1.0800 | $ 2700 |
In Stock: 610
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.8
Total :$ 1.80
Delivery :
Payment :
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3019L-8824-NL information
RDI, Inc 3019L-8824-NL technical specifications, attributes, parameters.
- Category:Connectors & Interconnects/Modular Connectors - Jacks
- Product Status:Active
- Features:Board Lock
- Ratings:-
- Mounting Type:Through Hole
- Ingress Protection:-
- Termination:Solder
- Connector Type:Jack
- Number of Rows:1
- Shielding:Unshielded
- Contact Finish:Gold
- Number of Positions/ Contacts:8p8c (RJ45, Ethernet)
- Orientation:90° Angle (Right)
- Contact Material:Phosphor Bronze
- Number of Ports:1
- L E D Color:Does Not Contain LED
- Tab Direction:Down
3019L-8824-NL provided by RDI, Inc
Founded in 1988, RDI(Research Develop Invonate) has been involved in thousands of projects worldwide, providing electronic components, engineering services and full system manufacturing, with the singular goal of helping deliver products that meet or exceed our customer’s schedule, specification and budget expectations.
Our growing line of products, including miniature switches, audio devices, speakers and custom cable assemblies that form the core of our component offering.
RDI’s headquarters and engineering facilities are located in Mount Kisco, NY with wholly-owned manufacturing operations in Shenzhen, China. Within these facilities we provide multiple discipline technical support including in-house tooling, SMT and through-hole PCB assembly, injection molding, PCB design, firmware development, industrial design, software/hardware, quality assurance along with materials management in support of both medium and high volume product manufacturing.
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