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pSemi PE42723A-Z

IC RF SWITCH SPDT 1.79GHZ 12QFN
part number has RoHS
Manufacturer # :PE42723A-Z
Manufacturer :pSemi
Dasenic # :PE42723A-Z-DS
Customer # :
Description : IC RF SWITCH SPDT 1.79GHZ 12QFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.4220$ 1.42
In Stock: 9066
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.422
Total :$ 1.42
Delivery :
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PE42723A-Z information

  • pSemi PE42723A-Z technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Switches
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Features:-
  • Package / Case:12-WFQFN Exposed Pad
  • Impedance:75Ohm
  • Frequency Range:5MHz ~ 1.79GHz
  • Supplier Device Package:12-QFN (3x3)
  • Voltage - Supply:2.3V ~ 5.5V
  • Circuit:SPDT
  • Topology:Reflective
  • Insertion Loss:0.3dB
  • Isolation:54dB
  • P1d B:-
  • R F Type:-
  • Test Frequency:204MHz, 1.2GHz
  • I I P3:-
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • REACH Status:REACH is not affected
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
PE42723A-Z provided by pSemi
pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductor’s 30-year legacy of technology advancements and strong IP portfolio but with a new mission: to enhance Murata’s world-class capabilities with high-performance RF, analog and mixed-signal solutions. With a strong foundation in RF integration, pSemi’s product portfolio now spans power management, connected sensors, antenna tuning and RF frontends. These intelligent and efficient semiconductors enable advanced modules for smartphones, base stations, personal computers, electric vehicles, data centers, IoT devices and healthcare. From headquarters in San Diego and offices around the world, pSemi’s team explores new ways to make electronics for the connected world smaller, thinner, faster and better.
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