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pSemi PE423641MLAA-Z

IC RF SWITCH SP4T 3GHZ 16QFN
part number has RoHS
Manufacturer # :PE423641MLAA-Z
Manufacturer :pSemi
Dasenic # :PE423641MLAA-Z-DS
Customer # :
Description : IC RF SWITCH SP4T 3GHZ 16QFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 2.5434$ 25.43
3000+$ 1.4130$ 4239
6000+$ 1.3613$ 8167.8
In Stock: 18000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.5434
Total :$ 2.54
Delivery :
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Payment :
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PE423641MLAA-Z information

  • pSemi PE423641MLAA-Z technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Switches
  • Product Status:Active
  • Operating Temperature:-40°C ~ 105°C
  • Features:-
  • Package / Case:16-WFQFN Exposed Pad
  • Impedance:50Ohm
  • Frequency Range:50MHz ~ 3GHz
  • Supplier Device Package:16-QFN (3x3)
  • Voltage - Supply:2.65V ~ 3.3V
  • Circuit:SP4T
  • Topology:Reflective
  • Insertion Loss:0.5dB
  • Isolation:32dB
  • P1d B:37dBm
  • R F Type:WCDMA
  • Test Frequency:1GHz
  • I I P3:68dBm
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
PE423641MLAA-Z provided by pSemi
pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductor’s 30-year legacy of technology advancements and strong IP portfolio but with a new mission: to enhance Murata’s world-class capabilities with high-performance RF, analog and mixed-signal solutions. With a strong foundation in RF integration, pSemi’s product portfolio now spans power management, connected sensors, antenna tuning and RF frontends. These intelligent and efficient semiconductors enable advanced modules for smartphones, base stations, personal computers, electric vehicles, data centers, IoT devices and healthcare. From headquarters in San Diego and offices around the world, pSemi’s team explores new ways to make electronics for the connected world smaller, thinner, faster and better.
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