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pSemi 4268-52

IC RF SWITCH SP6T 3GHZ 20QFN
part number has RoHS
Manufacturer # :4268-52
Manufacturer :pSemi
Dasenic # :4268-52-DS
Customer # :
Description : IC RF SWITCH SP6T 3GHZ 20QFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 3.9900$ 39.9
3000+$ 2.6600$ 7980
In Stock: 77
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.99
Total :$ 3.99
Delivery :
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4268-52 information

  • pSemi 4268-52 technical specifications, attributes, parameters.
  • Category:RF and Wireless/RF Switches
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Features:DC Blocked
  • Package / Case:20-WFQFN Exposed Pad
  • Impedance:50Ohm
  • Frequency Range:100MHz ~ 3GHz
  • Supplier Device Package:20-QFN (4x4)
  • Voltage - Supply:2.4V ~ 2.8V
  • Circuit:SP6T
  • Topology:Reflective
  • Insertion Loss:1.1dB
  • Isolation:24dB
  • P1d B:20dBm (min)
  • R F Type:General Purpose
  • Test Frequency:1.9GHz
  • I I P3:40dBm
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
4268-52 provided by pSemi
pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductor’s 30-year legacy of technology advancements and strong IP portfolio but with a new mission: to enhance Murata’s world-class capabilities with high-performance RF, analog and mixed-signal solutions. With a strong foundation in RF integration, pSemi’s product portfolio now spans power management, connected sensors, antenna tuning and RF frontends. These intelligent and efficient semiconductors enable advanced modules for smartphones, base stations, personal computers, electric vehicles, data centers, IoT devices and healthcare. From headquarters in San Diego and offices around the world, pSemi’s team explores new ways to make electronics for the connected world smaller, thinner, faster and better.
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