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Onsemi SZ1SMB5939BT3G-VF01

DIODE ZENER 39V 3W SMB
part number has RoHS
Manufacturer # :SZ1SMB5939BT3G-VF01
Manufacturer :Onsemi
Dasenic # :SZ1SMB5939BT3G-VF01-DS
Customer # :
Description : DIODE ZENER 39V 3W SMB
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 3000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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SZ1SMB5939BT3G-VF01 information

  • Onsemi SZ1SMB5939BT3G-VF01 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Diodes - Zener - Single
  • Product Status:Active
  • Tolerance:±5%
  • Operating Temperature:-65°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:DO-214AA, SMB
  • Power - Max:3 W
  • Supplier Device Package:SMB
  • Voltage - Forward ( Vf) ( Max) @ If:1.5 V @ 200 mA
  • Current - Reverse Leakage @ Vr:1 µA @ 29.7 V
  • Voltage - Zener ( Nom) ( Vz):39 V
  • Impedance ( Max) ( Zzt):45 Ohms
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
SZ1SMB5939BT3G-VF01 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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