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Onsemi SB007-03Q-TL-E
Manufacturer # :SB007-03Q-TL-E
Manufacturer :Onsemi
Dasenic # :SB007-03Q-TL-E-DS
Datasheet : SB007-03Q-TL-E Datasheet
Customer # :
Description : DIODE SCHOTTKY 30V 70MA 3MCP
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In Stock: 13131
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.225
Total :$ 0.23
Delivery :
Payment :
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SB007-03Q-TL-E information
Onsemi SB007-03Q-TL-E technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Single
- Product Status:Active
- Mounting Type:Surface Mount
- Package / Case:SC-70, SOT-323
- Supplier Device Package:3-MCP
- Speed:Small Signal =< 200mA (Io), Any Speed
- Diode Type:Schottky
- Current - Average Rectified ( Io):70mA
- Voltage - Forward ( Vf) ( Max) @ If:550 mV @ 70 mA
- Current - Reverse Leakage @ Vr:5 µA @ 15 V
- Capacitance @ Vr, F:3pF @ 10V, 1MHz
- Voltage - D C Reverse ( Vr) ( Max):30 V
- Reverse Recovery Time (trr):10 ns
- Operating Temperature - Junction:-55°C ~ 125°C
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.10.0070
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SB007-03Q-TL-E provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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