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Onsemi NXH350N100H4Q2F2SG
Manufacturer # :NXH350N100H4Q2F2SG
Manufacturer :Onsemi
Dasenic # :NXH350N100H4Q2F2SG-DS
Datasheet : NXH350N100H4Q2F2SG Datasheet
Customer # :
Description : IC MODULE PIM 350A 1000V
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In Stock: 83
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0
Total :$ 0.00
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NXH350N100H4Q2F2SG information
Onsemi NXH350N100H4Q2F2SG technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 150°C (TJ)
- Mounting Type:Chassis Mount
- Package / Case:Module
- Power - Max:592 W
- Supplier Device Package:42-PIM/Q2PACK (93x47)
- Configuration:Three Level Inverter
- Input:Standard
- Current - Collector ( Ic) ( Max):303 A
- Voltage - Collector Emitter Breakdown ( Max):1000 V
- Current - Collector Cutoff ( Max):1 mA
- I G B T Type:Trench Field Stop
- Vce(on) ( Max) @ Vge, Ic:1.8V @ 15V, 375A
- Input Capacitance ( Cies) @ Vce:24.146 nF @ 20 V
- N T C Thermistor:Yes
- EU RoHS Status:ROHS3 Compliant
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.29.0095
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
NXH350N100H4Q2F2SG provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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