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Onsemi NTHD3102CT1G
Manufacturer # :NTHD3102CT1G
Manufacturer :Onsemi
Dasenic # :NTHD3102CT1G-DS
Datasheet : NTHD3102CT1G Datasheet
Customer # :
Description : MOSFET N/P-CH 20V 4A/3.1A 1206A
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In Stock: 48708
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.5132
Total :$ 0.51
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NTHD3102CT1G information
Onsemi NTHD3102CT1G technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Arrays
- Product Status:Active
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:8-SMD, Flat Lead
- Power - Max:1.1W
- Supplier Device Package:ChipFET™
- F E T Type:N and P-Channel
- F E T Feature:Logic Level Gate
- Drain to Source Voltage ( Vdss):20V
- Current - Continuous Drain ( Id) @ 25° C:4A, 3.1A
- Rds On ( Max) @ Id, Vgs:45mOhm @ 4.4A, 4.5V
- Vgs(th) ( Max) @ Id:1.2V @ 250µA
- Gate Charge ( Qg) ( Max) @ Vgs:7.9nC @ 4.5V
- Input Capacitance ( Ciss) ( Max) @ Vds:510pF @ 10V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
NTHD3102CT1G provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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