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Onsemi NL17SG07MU3TBG-P

MOSFET N/P-CH
part number has RoHS
Manufacturer # :NL17SG07MU3TBG-P
Manufacturer :Onsemi
Dasenic # :NL17SG07MU3TBG-P-DS
Customer # :
Description : MOSFET N/P-CH
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 10
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
Delivery :
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NL17SG07MU3TBG-P information

  • Onsemi NL17SG07MU3TBG-P technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Buffers, Drivers, Receivers, Transceivers
  • Product Status:Obsolete
  • Operating Temperature:-55°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:6-UFDFN
  • Input Type:-
  • Output Type:Open Drain
  • Supplier Device Package:6-UDFN (1x1)
  • Number of Elements:1
  • Voltage - Supply:0.9V ~ 3.6V
  • Logic Type:Buffer, Inverting
  • Number of Bits per Element:1
  • Current - Output High, Low:-, 8mA
  • EU RoHS Status:ROHS3 Compliant
  • REACH Status:REACH Unaffected
  • US ECCN:OBSOLETE
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
NL17SG07MU3TBG-P provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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