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Onsemi NGTD13R120F2WP
Manufacturer # :NGTD13R120F2WP
Manufacturer :Onsemi
Dasenic # :NGTD13R120F2WP-DS
Datasheet : NGTD13R120F2WP Datasheet
Customer # :
Description : DIODE GEN PURP 1.2KV DIE
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In Stock: 29
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.4848
Total :$ 1.48
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NGTD13R120F2WP information
Onsemi NGTD13R120F2WP technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Single
- Product Status:Obsolete
- Mounting Type:Surface Mount
- Package / Case:Die
- Supplier Device Package:Die
- Speed:-
- Diode Type:Standard
- Current - Average Rectified ( Io):-
- Voltage - Forward ( Vf) ( Max) @ If:2.6 V @ 25 A
- Current - Reverse Leakage @ Vr:1 µA @ 1200 V
- Capacitance @ Vr, F:-
- Voltage - D C Reverse ( Vr) ( Max):1200 V
- Reverse Recovery Time (trr):-
- Operating Temperature - Junction:175°C (Max)
- EU RoHS Status:ROHS3 Compliant
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.10.0080
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
NGTD13R120F2WP provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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