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Onsemi NCV7703CD2R2G
Manufacturer # :NCV7703CD2R2G
Manufacturer :Onsemi
Dasenic # :NCV7703CD2R2G-DS
Datasheet : NCV7703CD2R2G Datasheet
Customer # :
Description : IC DVR HALF BRIDGE TRPL 14SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 36000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.6686
Total :$ 1.67
Delivery :
Payment :
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Onsemi NCV7703CD2R2G technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Full, Half-Bridge Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 150°C (TJ)
- Features:-
- Mounting Type:Surface Mount
- Package / Case:14-SOIC (0.154", 3.90mm Width)
- Technology:Power MOSFET
- Interface:SPI
- Supplier Device Package:14-SOIC
- Voltage - Supply:3.15V ~ 5.25V
- Current - Output / Channel:1.1A
- Current - Peak Output:-
- Fault Protection:Current Limiting, ESD, Over Temperature, Over Voltage, UVLO
- Output Configuration:Half Bridge (3)
- Load Type:Inductive
- Rds On ( Typ):800mOhm LS, 800mOhm HS
- Voltage - Load:5.5V ~ 40V
- Applications:DC Motors, General Purpose
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
NCV7703CD2R2G provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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