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Onsemi NCV7462DQ1R2G

IC TXRX CAN LIN 250MA LDO 36SSOP
part number has RoHS
Manufacturer # :NCV7462DQ1R2G
Manufacturer :Onsemi
Dasenic # :NCV7462DQ1R2G-DS
Customer # :
Description : IC TXRX CAN LIN 250MA LDO 36SSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 4.2030$ 4.2
10+$ 3.7710$ 37.71
50+$ 3.4380$ 171.9
100+$ 3.2130$ 321.3
500+$ 2.2410$ 1120.5
In Stock: 4500
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.203
Total :$ 4.20
Delivery :
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Payment :
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NCV7462DQ1R2G information

  • Onsemi NCV7462DQ1R2G technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Specialized ICs
  • Product Status:Active
  • Mounting Type:Surface Mount
  • Package / Case:36-BFSOP (0.295", 7.50mm Width) Exposed Pad
  • Type:System Basis Chip (SBC)
  • Supplier Device Package:36-SSOP-EP
  • Applications:CAN Automotive
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
NCV7462DQ1R2G provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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