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1 : $1.8720

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Onsemi NCV7451MW0R2G

SYSTEM BASIS CHIP WITH CAN FD, L
part number has RoHS
Manufacturer # :NCV7451MW0R2G
Manufacturer :Onsemi
Dasenic # :NCV7451MW0R2G-DS
Customer # :
Description : SYSTEM BASIS CHIP WITH CAN FD, L
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.8720$ 1.87
25+$ 1.6110$ 40.28
100+$ 1.2420$ 124.2
500+$ 1.0710$ 535.5
1000+$ 0.7587$ 758.7
In Stock: 11644
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.872
Total :$ 1.87
Delivery :
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Payment :
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NCV7451MW0R2G information

  • Onsemi NCV7451MW0R2G technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Specialized ICs
  • Product Status:Active
  • Mounting Type:Surface Mount, Wettable Flank
  • Package / Case:14-VDFN Exposed Pad
  • Type:System Basis Chip (SBC)
  • Supplier Device Package:14-DFNW (4.5x3)
  • Applications:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
NCV7451MW0R2G provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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