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Onsemi NCS37012MNTWG

IC GFCI CTLR CDM
part number has RoHS
Manufacturer # :NCS37012MNTWG
Manufacturer :Onsemi
Dasenic # :NCS37012MNTWG-DS
Customer # :
Description : IC GFCI CTLR CDM
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.0530$ 1.05
25+$ 1.0350$ 25.88
100+$ 0.9900$ 99
500+$ 0.9450$ 472.5
1000+$ 0.8963$ 896.3
In Stock: 6900
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.053
Total :$ 1.05
Delivery :
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Payment :
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NCS37012MNTWG information

  • Onsemi NCS37012MNTWG technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Power Management - Specialized
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:16-VFQFN Exposed Pad
  • Current - Supply:30µA
  • Supplier Device Package:16-QFN (3x3)
  • Voltage - Supply:6V ~ 12V
  • Applications:Ground Fault Protection
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
NCS37012MNTWG provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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