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Onsemi NCP6361AFCCT1G

IC REG CONV WIRELESS 1OUT 9WLCSP
part number has RoHS
Manufacturer # :NCP6361AFCCT1G
Manufacturer :Onsemi
Dasenic # :NCP6361AFCCT1G-DS
Customer # :
Description : IC REG CONV WIRELESS 1OUT 9WLCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.2340$ 0.23
25+$ 0.2293$ 5.73
100+$ 0.2200$ 22
500+$ 0.2106$ 105.3
1000+$ 0.1989$ 198.9
In Stock: 13536
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.234
Total :$ 0.23
Delivery :
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Payment :
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NCP6361AFCCT1G information

  • Onsemi NCP6361AFCCT1G technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Voltage Regulators - Special Purpose
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:9-UFBGA, WLCSP
  • Voltage - Input:2.5V ~ 5.5V
  • Supplier Device Package:9-WLCSP (1.36x1.22)
  • Voltage - Output:0.4V ~ 3.5V
  • Number of Outputs:1
  • Applications:Converter, Wireless Devices
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
NCP6361AFCCT1G provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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