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Onsemi NCP51460SN33T1G
Manufacturer # :NCP51460SN33T1G
Manufacturer :Onsemi
Dasenic # :NCP51460SN33T1G-DS
Datasheet : NCP51460SN33T1G Datasheet
Customer # :
Description : IC VREF SERIES 1% SOT23-3
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In Stock: 21844
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.2151
Total :$ 0.22
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NCP51460SN33T1G information
Onsemi NCP51460SN33T1G technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Reference
- Product Status:Active
- Tolerance:±1%
- Temperature Coefficient:18ppm/°C Typical
- Operating Temperature:0°C ~ 100°C (TA)
- Mounting Type:Surface Mount
- Package / Case:TO-236-3, SC-59, SOT-23-3
- Current - Supply:220µA
- Voltage - Input:4.2V ~ 28V
- Output Type:Fixed
- Supplier Device Package:SOT-23-3 (TO-236)
- Reference Type:Series
- Current - Output:20 mA
- Voltage - Output ( Min/ Fixed):3.3V
- Voltage - Output ( Max):-
- Noise - 0.1 Hz to 10 Hz:12µVp-p
- Noise - 10 Hz to 10k Hz:18µVrms
- Current - Cathode:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
NCP51460SN33T1G provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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