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Onsemi NCP308SN330T1G
Manufacturer # :NCP308SN330T1G
Manufacturer :Onsemi
Dasenic # :NCP308SN330T1G-DS
Datasheet : NCP308SN330T1G Datasheet
Customer # :
Description : IC SUPERVISOR 1 CHANNEL 6TSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6108
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.6019
Total :$ 0.60
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Onsemi NCP308SN330T1G technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Supervisors
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:SOT-23-6 Thin, TSOT-23-6
- Type:Simple Reset/Power-On Reset
- Supplier Device Package:6-TSOP
- Output:Open Drain or Open Collector
- Reset:Active Low
- Number of Voltages Monitored:1
- Voltage - Threshold:3.3V
- Reset Timeout:1.2s Typical
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
NCP308SN330T1G provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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