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Onsemi NCP1370BDR2G
Manufacturer # :NCP1370BDR2G
Manufacturer :Onsemi
Dasenic # :NCP1370BDR2G-DS
Datasheet : NCP1370BDR2G Datasheet
Customer # :
Description : IC LED DVR QUASI RES 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 7500
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3806
Total :$ 0.38
Delivery :
Payment :
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NCP1370BDR2G information
Onsemi NCP1370BDR2G technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - LED Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Frequency:-
- Type:DC DC Controller
- Supplier Device Package:8-SOIC
- Internal Switch(s):No
- Voltage - Output:-
- Current - Output / Channel:-
- Number of Outputs:1
- Topology:Flyback, SEPIC, Step-Down (Buck), Step-Up (Boost)
- Voltage - Supply ( Max):26V
- Voltage - Supply ( Min):9.5V
- Dimming:Analog, PWM
- Applications:Backlight, Lighting
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
NCP1370BDR2G provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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