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Onsemi NC7SP17L6X-L22780
Manufacturer # :NC7SP17L6X-L22780
Manufacturer :Onsemi
Dasenic # :NC7SP17L6X-L22780-DS
Datasheet : NC7SP17L6X-L22780 Datasheet
Customer # :
Description : IC BUF NON-INVERT 3.6V 6MICROPAK
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In Stock: 7431
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.117
Total :$ 0.12
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NC7SP17L6X-L22780 information
Onsemi NC7SP17L6X-L22780 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Buffers, Drivers, Receivers, Transceivers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:6-UFDFN
- Input Type:Schmitt Trigger
- Output Type:Push-Pull
- Supplier Device Package:6-MicroPak
- Number of Elements:1
- Voltage - Supply:0.9V ~ 3.6V
- Logic Type:Buffer, Non-Inverting
- Number of Bits per Element:1
- Current - Output High, Low:2.6mA, 2.6mA
- Series:7SP
- Base Product Number:NC7SP17
- Packaging:Tape & Reel (TR)
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
NC7SP17L6X-L22780 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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