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Onsemi N01S830HAT22I

Name: N01S830HAT22I
Brand: Onsemi
SKU: N01S830HAT22I-DS
Price: 4.5360 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 7590

MOQ: 1

5 Price Tiers

Mfr.Part # :N01S830HAT22I
Manufacturer :Onsemi
Dasenic # :N01S830HAT22I-DS
Datasheet : N01S830HAT22I Datasheet PDF
Description : IC SRAM 1MBIT SPI 20MHZ 8TSSOP
Package :-
Unit Price: $4.5360
Total: $4.54

Quantity	Unit Price	You Save
1-1	$4.5360	-
2-10	$4.0293	11.2% save
11-25	$4.5360	-
26-50	$3.7062	18.3% save
51-100	$3.5753	21.2% save

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Onsemi N01S830HAT22I technical specifications, attributes, parameters.

Category:Integrated Circuits (ICs)/Memory Integrated Circuit

Product Status:Active

Operating Temperature:-40°C ~ 85°C (TA)

Mounting Type:Surface Mount

Package / Case:8-TSSOP (0.173", 4.40mm Width)

Technology:SRAM

Supplier Device Package:8-TSSOP

Memory Size:1Mb (128K x 8)

Memory Type:Volatile

Voltage - Supply:2.5V ~ 5.5V

Clock Frequency:20 MHz

Access Time:-

Memory Format:SRAM

Memory Interface:SPI

Write Cycle Time - Word, Page:-

EU RoHS Status:ROHS3 Compliant

MSL Rating:3 (168 Hours,30°C/60%RH)

REACH Status:REACH Unaffected

US ECCN:3A991B2B

HTS US:8542.32.0041

China RoHS Status:Green Symbol: Green and environmentally friendly product

N01S830HAT22I provided by Onsemi

Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.

Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.

With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.