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Onsemi MOC81053S
Manufacturer # :MOC81053S
Manufacturer :Onsemi
Dasenic # :MOC81053S-DS
Datasheet : MOC81053S Datasheet
Customer # :
Description : OPTOISOLATOR 5.3KV TRANS 6-SMD
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In Stock: 6648
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.2587
Total :$ 6.26
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MOC81053S information
Onsemi MOC81053S technical specifications, attributes, parameters.
- Category:Isolators/Optoisolators - Transistor, Photovoltaic Output
- Product Status:Obsolete
- Package / Case:6-SMD, Gull Wing
- Operating Temperature:-55°C ~ 100°C
- Voltage- Isolation:5300Vrms
- Numberof Channels:1
- Input Type:DC
- Output Type:Transistor
- Current- Output/ Channel:50mA
- Rise/ Fall Time( Typ):1µs, 2µs
- Voltage- Output( Max):30V
- Voltage- Forward( Vf)( Typ):1.15V
- Current- D C Forward( If)( Max):100 mA
- Vce Saturation( Max):400mV
- Turn On/ Turn Off Time( Typ):2µs, 3µs
- Current Transfer Ratio( Max):133% @ 10mA
- Current Transfer Ratio( Min):65% @ 10mA
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MOC81053S provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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