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Onsemi MDA6441C
Manufacturer # :MDA6441C
Manufacturer :Onsemi
Dasenic # :MDA6441C-DS
Datasheet : MDA6441C Datasheet
Customer # :
Description : DISP 14SEG 0.54 DBL GRN 18DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 2772
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.9
Total :$ 4.90
Delivery :
Payment :
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MDA6441C information
Onsemi MDA6441C technical specifications, attributes, parameters.
- Category:Optoelectronics Devices/Display Modules - LED Character and Numeric
- Product Status:Obsolete
- Color:Green
- Package / Case:18-DIP (0.600", 15.24mm), 14 Leads
- Size / Dimension:0.835" H x 0.996" W x 0.307" D (21.20mm x 25.30mm x 7.80mm)
- Power Dissipation ( Max):70mW
- Display Type:14-Segment, Alphanumeric
- Current - Test:20mA
- Voltage - Forward ( Vf) ( Typ):2.1V
- Number of Characters:2
- Display Format:-
- Digit/ Alpha Size:0.54" (13.72mm)
- Common Pin:Common Cathode
- Millicandela Rating:5mcd
- Wavelength - Peak:570nm
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MDA6441C provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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