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Onsemi MC74LVX541DTR2G
IC BUF NON-INVERT 3.6V 20TSSOP
Manufacturer # :MC74LVX541DTR2G
Manufacturer :Onsemi
Dasenic # :MC74LVX541DTR2G-DS
Datasheet :
MC74LVX541DTR2G Datasheet
MC74LVX541DTR2G DatasheetCustomer # :
Description : IC BUF NON-INVERT 3.6V 20TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.1890 | $ 0.19 |
In Stock: 46180
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.189
Total :$ 0.19
Delivery :
Payment :
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MC74LVX541DTR2G information
Onsemi MC74LVX541DTR2G technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Buffers, Drivers, Receivers, Transceivers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:20-TSSOP (0.173", 4.40mm Width)
- Input Type:-
- Output Type:3-State
- Supplier Device Package:20-TSSOP
- Number of Elements:1
- Voltage - Supply:2V ~ 3.6V
- Logic Type:Buffer, Non-Inverting
- Number of Bits per Element:8
- Current - Output High, Low:4mA, 4mA
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MC74LVX541DTR2G provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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