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  • Onsemi MC74HCT74ADG

    IC FF D-TYPE DUAL 1BIT 14SOIC
  • part number has RoHS
  • Mfr.Part # :MC74HCT74ADG
  • Manufacturer :Onsemi
  • Dasenic # :MC74HCT74ADG-DS
  • Datasheet :pdf download MC74HCT74ADG Datasheet
  • Description : IC FF D-TYPE DUAL 1BIT 14SOIC
  • Package :-
  • Quantity :
    Unit Price : $ 0.0864Total : $ 0.09
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 48713
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 0.0864$ 0.09
10 +$ 0.0815$ 0.82

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Onsemi MC74HCT74ADG technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Flip Flops
Product Status:Active
Operating Temperature:-55°C ~ 125°C (TA)
Mounting Type:Surface Mount
Package / Case:14-SOIC (0.154", 3.90mm Width)
Type:D-Type
Output Type:Complementary
Supplier Device Package:14-SOIC
Number of Elements:2
Voltage - Supply:4.5V ~ 5.5V
Clock Frequency:30 MHz
Number of Bits per Element:1
Current - Output High, Low:4mA, 4mA
Max Propagation Delay @ V, Max C L:24ns @ 5V, 50pF
Current - Quiescent ( Iq):2 µA
Trigger Type:Positive Edge
Input Capacitance:10 pF
Function:Set(Preset) and Reset
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
MC74HCT74ADG provided by Onsemi

Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.

Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.

With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.

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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.

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