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Onsemi MC74HC373AFELG
Manufacturer # :MC74HC373AFELG
Manufacturer :Onsemi
Dasenic # :MC74HC373AFELG-DS
Datasheet : MC74HC373AFELG Datasheet
Customer # :
Description : IC LATCH TRANSP OCT 3ST 20SOEIAJ
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 24721
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.18
Total :$ 0.18
Delivery :
Payment :
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MC74HC373AFELG information
Onsemi MC74HC373AFELG technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Latches
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:20-SOIC (0.209", 5.30mm Width)
- Output Type:Tri-State
- Supplier Device Package:SOEIAJ-20
- Voltage - Supply:2V ~ 6V
- Logic Type:D-Type Transparent Latch
- Current - Output High, Low:7.8mA, 7.8mA
- Circuit:8:8
- Independent Circuits:1
- Delay Time - Propagation:21ns
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MC74HC373AFELG provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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