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Onsemi MC74ACT573DTR2

IC BUFF DVR TRI-ST OCTAL 20TSSOP
part number has RoHS
Manufacturer # :MC74ACT573DTR2
Manufacturer :Onsemi
Dasenic # :MC74ACT573DTR2-DS
Customer # :
Description : IC BUFF DVR TRI-ST OCTAL 20TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 0.6390$ 6.39
100+$ 0.5085$ 50.85
1000+$ 0.4500$ 450
10000+$ 0.4500$ 4500
In Stock: 5778
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.639
Total :$ 0.64
Delivery :
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Payment :
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MC74ACT573DTR2 information

  • Onsemi MC74ACT573DTR2 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Latches
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:20-TSSOP (0.173", 4.40mm Width)
  • Output Type:Tri-State
  • Supplier Device Package:20-TSSOP
  • Voltage - Supply:4.5V ~ 5.5V
  • Logic Type:D-Type Transparent Latch
  • Current - Output High, Low:24mA, 24mA
  • Circuit:1:8
  • Independent Circuits:1
  • Delay Time - Propagation:10.5ns
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MC74ACT573DTR2 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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