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Onsemi MC74AC10DG
Manufacturer # :MC74AC10DG
Manufacturer :Onsemi
Dasenic # :MC74AC10DG-DS
Datasheet : MC74AC10DG Datasheet
Customer # :
Description : IC GATE NAND 3CH 3-INP 14SOIC
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In Stock: 44336
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.624
Total :$ 0.62
Delivery :
Payment :
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MC74AC10DG information
Onsemi MC74AC10DG technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Gates and Inverters
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Features:-
- Mounting Type:Surface Mount
- Package / Case:14-SOIC (0.154", 3.90mm Width)
- Supplier Device Package:14-SOIC
- Number of Circuits:3
- Voltage - Supply:2V ~ 6V
- Number of Inputs:3
- Current - Quiescent ( Max):4 µA
- Logic Type:NAND Gate
- Current - Output High, Low:24mA, 24mA
- Max Propagation Delay @ V, Max C L:7ns @ 5V, 50pF
- Logic Level - Low:0.9V ~ 1.65V
- Logic Level - High:2.1V ~ 3.85V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MC74AC10DG provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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