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Onsemi MC33342DR2G
Manufacturer # :MC33342DR2G
Manufacturer :Onsemi
Dasenic # :MC33342DR2G-DS
Datasheet : MC33342DR2G Datasheet
Customer # :
Description : IC BATT CHG MULTI-CHEM 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1506
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.4516
Total :$ 1.45
Delivery :
Payment :
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MC33342DR2G information
Onsemi MC33342DR2G technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Battery Chargers
- Product Status:Obsolete
- Operating Temperature:-25°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Battery Chemistry:Multi-Chemistry
- Number of Cells:-
- Charge Current - Max:-
- Interface:-
- Supplier Device Package:8-SOIC
- Fault Protection:Over Temperature, Over Voltage
- Current - Charging:-
- Programmable Features:Timer
- Battery Pack Voltage:-
- Voltage - Supply ( Max):18V
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MC33342DR2G provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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