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Onsemi MC14071BDTR2
IC GATE OR 4CH 2-INP 14TSSOP
Manufacturer # :MC14071BDTR2
Manufacturer :Onsemi
Dasenic # :MC14071BDTR2-DS
Datasheet :
MC14071BDTR2 Datasheet
MC14071BDTR2 DatasheetCustomer # :
Description : IC GATE OR 4CH 2-INP 14TSSOP
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| Quantity | Unit Price | Total |
In Stock: 10
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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MC14071BDTR2 information
Onsemi MC14071BDTR2 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Gates and Inverters
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 125°C
- Features:-
- Mounting Type:Surface Mount
- Package / Case:14-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package:14-TSSOP
- Number of Circuits:4
- Voltage - Supply:3V ~ 18V
- Number of Inputs:2
- Current - Quiescent ( Max):1 µA
- Logic Type:OR Gate
- Current - Output High, Low:8.8mA, 8.8mA
- Max Propagation Delay @ V, Max C L:100ns @ 15V, 50pF
- Logic Level - Low:1.5V ~ 4V
- Logic Level - High:3.5V ~ 11V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MC14071BDTR2 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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