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Onsemi MC10H189MELG
Manufacturer # :MC10H189MELG
Manufacturer :Onsemi
Dasenic # :MC10H189MELG-DS
Datasheet : MC10H189MELG Datasheet
Customer # :
Description : IC BUF INVERT -5.46V 16SOEIAJ
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 5625
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.948
Total :$ 6.95
Delivery :
Payment :
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MC10H189MELG information
Onsemi MC10H189MELG technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Buffers, Drivers, Receivers, Transceivers
- Product Status:Obsolete
- Operating Temperature:0°C ~ 75°C (TA)
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.209", 5.30mm Width)
- Input Type:-
- Output Type:Push-Pull
- Supplier Device Package:16-SOEIAJ
- Number of Elements:1
- Voltage - Supply:-4.94V ~ -5.46V
- Logic Type:Buffer, Inverting
- Number of Bits per Element:6
- Current - Output High, Low:-
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MC10H189MELG provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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