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Onsemi MC10H116DR2G

IC RECEIVER 0/3 16SOIC
part number has RoHS
Manufacturer # :MC10H116DR2G
Manufacturer :Onsemi
Dasenic # :MC10H116DR2G-DS
Customer # :
Description : IC RECEIVER 0/3 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 9.6404$ 96.4
2500+$ 5.3558$ 13389.5
In Stock: 635
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.6404
Total :$ 9.64
Delivery :
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Payment :
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MC10H116DR2G information

  • Onsemi MC10H116DR2G technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Drivers, Receivers, Transceivers
  • Product Status:Active
  • Operating Temperature:0°C ~ 75°C
  • Mounting Type:Surface Mount
  • Package / Case:16-SOIC (0.154", 3.90mm Width)
  • Type:Receiver
  • Supplier Device Package:16-SOIC
  • Voltage - Supply:4.94V ~ 5.46V
  • Protocol:-
  • Number of Drivers/ Receivers:0/3
  • Duplex:-
  • Receiver Hysteresis:-
  • Data Rate:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MC10H116DR2G provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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