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Onsemi MC10EP89DTG
Manufacturer # :MC10EP89DTG
Manufacturer :Onsemi
Dasenic # :MC10EP89DTG-DS
Datasheet : MC10EP89DTG Datasheet
Customer # :
Description : IC DRIVER 1/0 8TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.436
Total :$ 5.44
Delivery :
Payment :
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MC10EP89DTG information
Onsemi MC10EP89DTG technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Drivers, Receivers, Transceivers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- Type:Driver
- Supplier Device Package:8-TSSOP
- Voltage - Supply:3V ~ 5.5V
- Protocol:-
- Number of Drivers/ Receivers:1/0
- Duplex:-
- Receiver Hysteresis:-
- Data Rate:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MC10EP89DTG provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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