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Onsemi MC10EP11DTR2G

IC CLK BUFFER 1:2 3GHZ 8TSSOP
part number has RoHS
Manufacturer # :MC10EP11DTR2G
Manufacturer :Onsemi
Dasenic # :MC10EP11DTR2G-DS
Customer # :
Description : IC CLK BUFFER 1:2 3GHZ 8TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 4.1580$ 4.16
100+$ 3.1140$ 311.4
1000+$ 2.7000$ 2700
In Stock: 13233
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.158
Total :$ 4.16
Delivery :
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MC10EP11DTR2G information

  • Onsemi MC10EP11DTR2G technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Type:Fanout Buffer (Distribution)
  • Supplier Device Package:8-TSSOP
  • Frequency - Max:3 GHz
  • Number of Circuits:1
  • Output:ECL, PECL
  • Voltage - Supply:3V ~ 5.5V
  • Input:ECL, PECL
  • Ratio - Input: Output:1:2
  • Differential - Input: Output:Yes/Yes
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MC10EP11DTR2G provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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