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Onsemi MBR30H150CTG
Manufacturer # :MBR30H150CTG
Manufacturer :Onsemi
Dasenic # :MBR30H150CTG-DS
Datasheet : MBR30H150CTG Datasheet
Customer # :
Description : DIODE ARRAY SCHOTTKY 150V TO220
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In Stock: 32
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0
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MBR30H150CTG information
Onsemi MBR30H150CTG technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Arrays
- Product Status:Obsolete
- Mounting Type:Through Hole
- Package / Case:TO-220-3
- Supplier Device Package:TO-220
- Speed:Fast Recovery =< 500ns, > 200mA (Io)
- Diode Type:Schottky
- Voltage - Forward ( Vf) ( Max) @ If:1.11 V @ 15 A
- Current - Reverse Leakage @ Vr:60 µA @ 150 V
- Diode Configuration:1 Pair Common Cathode
- Voltage - D C Reverse ( Vr) ( Max):150 V
- Current - Average Rectified ( Io) (per Diode):15A
- Reverse Recovery Time (trr):-
- Operating Temperature - Junction:-20°C ~ 150°C
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.10.0080
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MBR30H150CTG provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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