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Onsemi M1MA174T1G
Manufacturer # :M1MA174T1G
Manufacturer :Onsemi
Dasenic # :M1MA174T1G-DS
Datasheet : M1MA174T1G Datasheet
Customer # :
Description : DIODE GEN PURP 100V 200MA SC70-3
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In Stock: 41697
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.0225
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M1MA174T1G information
Onsemi M1MA174T1G technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Single
- Product Status:Obsolete
- Mounting Type:Surface Mount
- Package / Case:SC-70, SOT-323
- Supplier Device Package:SC-70-3 (SOT323)
- Speed:Small Signal =< 200mA (Io), Any Speed
- Diode Type:Standard
- Current - Average Rectified ( Io):200mA (DC)
- Voltage - Forward ( Vf) ( Max) @ If:1 V @ 10 mA
- Current - Reverse Leakage @ Vr:5 µA @ 75 V
- Capacitance @ Vr, F:4pF @ 0V, 1MHz
- Voltage - D C Reverse ( Vr) ( Max):100 V
- Reverse Recovery Time (trr):4 ns
- Operating Temperature - Junction:-50°C ~ 150°C
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.10.0070
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
M1MA174T1G provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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