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Onsemi M100LVEP111FATWG
Manufacturer # :M100LVEP111FATWG
Manufacturer :Onsemi
Dasenic # :M100LVEP111FATWG-DS
Datasheet : M100LVEP111FATWG Datasheet
Customer # :
Description : IC CLK BUFFER 2:10 3GHZ 32LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 9226
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.564
Total :$ 3.56
Delivery :
Payment :
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M100LVEP111FATWG information
Onsemi M100LVEP111FATWG technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:32-LQFP
- Type:Fanout Buffer (Distribution), Multiplexer
- Supplier Device Package:32-LQFP (7x7)
- Frequency - Max:3 GHz
- Number of Circuits:1
- Output:ECL, PECL
- Voltage - Supply:2.375V ~ 3.8V
- Input:ECL, HSTL, PECL
- Ratio - Input: Output:2:10
- Differential - Input: Output:Yes/Yes
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
M100LVEP111FATWG provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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