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Onsemi LY85_BZ84C8V2
DIODE ZENER DIE
Manufacturer # :LY85_BZ84C8V2
Manufacturer :Onsemi
Dasenic # :LY85_BZ84C8V2-DS
Datasheet :
LY85_BZ84C8V2 Datasheet
LY85_BZ84C8V2 DatasheetCustomer # :
Description : DIODE ZENER DIE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
In Stock: 46
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
Delivery :
Payment :
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LY85_BZ84C8V2 information
Onsemi LY85_BZ84C8V2 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Zener - Single
- Product Status:Obsolete
- Tolerance:-
- Operating Temperature:-
- Mounting Type:Surface Mount
- Package / Case:Die
- Power - Max:-
- Supplier Device Package:Die
- Voltage - Forward ( Vf) ( Max) @ If:-
- Current - Reverse Leakage @ Vr:-
- Voltage - Zener ( Nom) ( Vz):-
- Impedance ( Max) ( Zzt):-
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:OBSOLETE
- HTS US:0000.00.0000
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LY85_BZ84C8V2 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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