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Onsemi LE25S81AFDTWG

Name: LE25S81AFDTWG
Brand: Onsemi
SKU: LE25S81AFDTWG-DS
Price: 0.7749 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 50472

MOQ: 1

4 Price Tiers

Mfr.Part # :LE25S81AFDTWG
Manufacturer :Onsemi
Dasenic # :LE25S81AFDTWG-DS
Datasheet : LE25S81AFDTWG Datasheet PDF
Description : IC FLASH 8MBIT SPI 70MHZ 8VSOIC
Package :-
Unit Price: $0.7749
Total: $0.77

Quantity	Unit Price	You Save
10+	$0.7749	-
100+	$0.7749	-
1000+	$0.2853	63.2% save
10000+	$0.2853	63.2% save

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Onsemi LE25S81AFDTWG technical specifications, attributes, parameters.

Category:Integrated Circuits (ICs)/Memory Integrated Circuit

Product Status:Last Time Buy

Operating Temperature:-40°C ~ 90°C (TA)

Mounting Type:Surface Mount

Package / Case:8-SOIC (0.154", 3.90mm Width)

Technology:Flash

Supplier Device Package:8-VSOIC

Memory Size:8Mb (1M x 8)

Memory Type:Non-Volatile

Voltage - Supply:1.65V ~ 1.95V

Clock Frequency:70 MHz

Access Time:-

Memory Format:Flash

Memory Interface:SPI

Write Cycle Time - Word, Page:500µs

EU RoHS Status:RoHS Compliant

REACH Status:Vendor is not defined

US ECCN:Provided as per user requirements

China RoHS Status:Green Symbol: Green and environmentally friendly product

LE25S81AFDTWG provided by Onsemi

Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.

Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.

With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.