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Onsemi LC87F57C8AU-DIP-E
Manufacturer # :LC87F57C8AU-DIP-E
Manufacturer :Onsemi
Dasenic # :LC87F57C8AU-DIP-E-DS
Datasheet : LC87F57C8AU-DIP-E Datasheet
Customer # :
Description : IC MCU 8BIT 128KB FLASH
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1441
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 22.2844
Total :$ 22.28
Delivery :
Payment :
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LC87F57C8AU-DIP-E information
Onsemi LC87F57C8AU-DIP-E technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Obsolete
- Operating Temperature:-20°C ~ 70°C (TA)
- Mounting Type:-
- Package / Case:-
- Supplier Device Package:-
- Peripherals:PWM, WDT
- Number of I/ O:43
- Speed:10MHz
- E E P R O M Size:-
- Core Processor:-
- R A M Size:3K x 8
- Program Memory Type:Flash
- Core Size:8-Bit
- Connectivity:Serial I/O
- Program Memory Size:128KB (128K x 8)
- Voltage - Supply ( Vcc/ Vdd):2.5V ~ 5.5V
- Data Converters:A/D 12x8b
- Oscillator Type:Internal
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.31.0001
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LC87F57C8AU-DIP-E provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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