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Onsemi LC823425-12G1-LR-H
IC AUDIO PROCESSOR 128TQFP
Manufacturer # :LC823425-12G1-LR-H
Manufacturer :Onsemi
Dasenic # :LC823425-12G1-LR-H-DS
Datasheet :
LC823425-12G1-LR-H Datasheet
LC823425-12G1-LR-H DatasheetCustomer # :
Description : IC AUDIO PROCESSOR 128TQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 40+ | $ 33.2800 | $ 1331.2 |
In Stock: 2942
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 33.28
Total :$ 33.28
Delivery :
Payment :
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LC823425-12G1-LR-H information
Onsemi LC823425-12G1-LR-H technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Audio Special Purpose
- Product Status:Obsolete
- Operating Temperature:-20°C ~ 75°C (TA)
- Mounting Type:Surface Mount
- Package / Case:128-TQFP
- Number of Channels:1
- Interface:PCM
- Specifications:-
- Supplier Device Package:128-TQFP (14x14)
- Voltage - Supply:-
- Applications:Audio Systems
- Function:Audio Processor
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:4 (72 Hours)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LC823425-12G1-LR-H provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.