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Onsemi LC06511F03MXTAG

IC BATT PROTECTION CTLR X2DFN6
part number has RoHS
Manufacturer # :LC06511F03MXTAG
Manufacturer :Onsemi
Dasenic # :LC06511F03MXTAG-DS
Customer # :
Description : IC BATT PROTECTION CTLR X2DFN6
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 89.9910$ 89.99
In Stock: 1945
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 89.991
Total :$ 89.99
Delivery :
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Payment :
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LC06511F03MXTAG information

  • Onsemi LC06511F03MXTAG technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Battery Management
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:6-XFDFN Exposed Pad
  • Battery Chemistry:Lithium Ion/Polymer
  • Number of Cells:1
  • Interface:-
  • Supplier Device Package:6-X2DFN (1.4x1.4)
  • Fault Protection:Over Current, Over Temperature
  • Function:Battery Protection
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LC06511F03MXTAG provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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