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Onsemi LB1863M-TLM-H
Manufacturer # :LB1863M-TLM-H
Manufacturer :Onsemi
Dasenic # :LB1863M-TLM-H-DS
Datasheet : LB1863M-TLM-H Datasheet
Customer # :
Description : IC MOTOR DRIVER ON/OFF 14MFP
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In Stock: 15804
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.8175
Total :$ 0.82
Delivery :
Payment :
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LB1863M-TLM-H information
Onsemi LB1863M-TLM-H technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Full, Half-Bridge Drivers
- Product Status:Active
- Operating Temperature:-30°C ~ 80°C (TA)
- Features:-
- Mounting Type:Surface Mount
- Package / Case:14-LSOP (0.173", 4.40mm Width)
- Technology:Bipolar
- Interface:Logic
- Supplier Device Package:14-SOIC/MFPS
- Voltage - Supply:6.4V ~ 7V
- Current - Output / Channel:1.5A
- Current - Peak Output:-
- Fault Protection:Over Temperature
- Output Configuration:Half Bridge (2)
- Load Type:Inductive
- Rds On ( Typ):-
- Voltage - Load:24V
- Applications:DC Motors, General Purpose
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LB1863M-TLM-H provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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