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Onsemi LB11946-E
Manufacturer # :LB11946-E
Manufacturer :Onsemi
Dasenic # :LB11946-E-DS
Datasheet : LB11946-E Datasheet
Customer # :
Description : IC MOTOR DRIVER BIPOLAR 28HDIP
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In Stock: 84
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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LB11946-E information
Onsemi LB11946-E technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Motor Drivers, Controllers
- Product Status:Obsolete
- Operating Temperature:-25°C ~ 85°C (TA)
- Mounting Type:Through Hole
- Package / Case:28-SDIP (0.500", 12.70mm) Exposed Pad
- Technology:Bipolar
- Interface:Parallel, Serial
- Supplier Device Package:28-HDIP
- Voltage - Supply:3V ~ 3.6V, 4.5V ~ 5.5V
- Current - Output:1A
- Output Configuration:Half Bridge (4)
- Voltage - Load:10V ~ 45V
- Motor Type - Stepper:Bipolar
- Motor Type - A C, D C:-
- Step Resolution:-
- Applications:General Purpose
- Function:Driver - Fully Integrated, Control and Power Stage
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LB11946-E provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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