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Onsemi LA6571-TLM-E

IC OPAMP GP 5 CIRCUIT 36HSOPR
part number has RoHS
Manufacturer # :LA6571-TLM-E
Manufacturer :Onsemi
Dasenic # :LA6571-TLM-E-DS
Customer # :
Description : IC OPAMP GP 5 CIRCUIT 36HSOPR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 6.6929$ 66.93
1000+$ 4.4619$ 4461.9
2000+$ 4.2942$ 8588.4
In Stock: 65
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.6929
Total :$ 6.69
Delivery :
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Payment :
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LA6571-TLM-E information

  • Onsemi LA6571-TLM-E technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Specialized ICs
  • Product Status:Obsolete
  • Mounting Type:Surface Mount
  • Package / Case:36-SOP (0.311", 7.90mm Width) Exposed Pad + 2 Heat Tabs
  • Type:Driver
  • Supplier Device Package:36-HSOP-R
  • Applications:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LA6571-TLM-E provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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