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Onsemi J177_D75Z
Manufacturer # :J177_D75Z
Manufacturer :Onsemi
Dasenic # :J177_D75Z-DS
Datasheet : J177_D75Z Datasheet
Customer # :
Description : JFET P-CH 30V 0.35W TO92
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In Stock: 49
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0
Total :$ 0.00
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J177_D75Z information
Onsemi J177_D75Z technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - JFETs
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-226-3, TO-92-3 (TO-226AA) Formed Leads
- Power - Max:350 mW
- Supplier Device Package:TO-92-3
- F E T Type:P-Channel
- Drain to Source Voltage ( Vdss):-
- Input Capacitance ( Ciss) ( Max) @ Vds:-
- Voltage - Breakdown ( V( B R) G S S):30 V
- Current - Drain ( Idss) @ Vds ( Vgs=0):1.5 mA @ 15 V
- Current Drain ( Id) - Max:-
- Voltage - Cutoff ( V G S off) @ Id:800 mV @ 10 nA
- Resistance - R D S( On):300 Ohms
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.21.0095
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
J177_D75Z provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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