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Onsemi HCPL2601VM
Manufacturer # :HCPL2601VM
Manufacturer :Onsemi
Dasenic # :HCPL2601VM-DS
Datasheet : HCPL2601VM Datasheet
Customer # :
Description : 8PW 10MB DIP VDE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 5400
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.106
Total :$ 2.11
Delivery :
Payment :
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HCPL2601VM information
Onsemi HCPL2601VM technical specifications, attributes, parameters.
- Category:Isolators/Optoisolators - Logic Output
- Product Status:Active
- Package / Case:8-DIP (0.300, 7.62mm)
- Mounting Type:Through Hole
- Operating Temperature:-40°C ~ 85°C
- Voltage- Isolation:2500Vrms
- Voltage- Supply:5.5V
- Numberof Channels:1
- Input Type:DC
- Output Type:Open Collector, Schottky Clamped
- Data Rate:10Mbps
- Current- Output/ Channel:50 mA
- Rise/ Fall Time( Typ):50ns, 12ns
- Inputs- Side1/ Side2:1/0
- Propagation Delaytp L H/tp H L( Max):75ns, 75ns
- Common Mode Transient Immunity( Min):5kV/µs
- Voltage- Forward( Vf)( Typ):1.4V
- Current- D C Forward( If)( Max):30mA
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HCPL2601VM provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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