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Onsemi H11N3VM
Manufacturer # :H11N3VM
Manufacturer :Onsemi
Dasenic # :H11N3VM-DS
Datasheet : H11N3VM Datasheet
Customer # :
Description : OPTOISO 4.17KV OPN COLL 6DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1840
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.7809
Total :$ 8.78
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H11N3VM information
Onsemi H11N3VM technical specifications, attributes, parameters.
- Category:Isolators/Optoisolators - Logic Output
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Through Hole
- Package / Case:6-DIP (0.300", 7.62mm)
- Input Type:DC
- Output Type:Open Collector
- Number of Channels:1
- Supplier Device Package:6-DIP
- Voltage - Supply:4V ~ 15V
- Data Rate:5MHz
- Current - Output / Channel:50 mA
- Voltage - Isolation:4170Vrms
- Rise / Fall Time ( Typ):7.5ns, 12ns
- Inputs - Side 1/ Side 2:1/0
- Common Mode Transient Immunity ( Min):-
- Propagation Delay tp L H / tp H L ( Max):330ns, 330ns
- Voltage - Forward ( Vf) ( Typ):1.4V
- Current - D C Forward ( If) ( Max):30mA
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.49.8000
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
H11N3VM provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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