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Onsemi H11C3300W
Manufacturer # :H11C3300W
Manufacturer :Onsemi
Dasenic # :H11C3300W-DS
Datasheet : H11C3300W Datasheet
Customer # :
Description : OPTOISOLATOR 5.3KV SCR 6DIP
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In Stock: 72
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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H11C3300W information
Onsemi H11C3300W technical specifications, attributes, parameters.
- Category:Isolators/Optoisolators - Triac, SCR Output
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 100°C
- Mounting Type:Through Hole
- Package / Case:6-DIP (0.400", 10.16mm)
- Approval Agency:UR, VDE
- Output Type:SCR
- Number of Channels:1
- Supplier Device Package:6-DIP
- Voltage - Off State:200 V
- Current - Hold ( Ih):-
- Voltage - Isolation:5300Vrms
- Current - On State ( It ( R M S)) ( Max):300 mA
- Voltage - Forward ( Vf) ( Typ):1.2V
- Current - D C Forward ( If) ( Max):60 mA
- Zero Crossing Circuit:No
- Static d V/dt ( Min):500V/µs
- Current - L E D Trigger ( Ift) ( Max):30mA
- Turn On Time:-
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.49.8000
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
H11C3300W provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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