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Onsemi FUSB3307P6A0BFMNWTWG
Manufacturer # :FUSB3307P6A0BFMNWTWG
Manufacturer :Onsemi
Dasenic # :FUSB3307P6A0BFMNWTWG-DS
Datasheet : FUSB3307P6A0BFMNWTWG Datasheet
Customer # :
Description : 60W WITH PDIV1/PDIV0 USB TYPE-C
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 11688
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.107
Total :$ 1.11
Delivery :
Payment :
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FUSB3307P6A0BFMNWTWG information
Onsemi FUSB3307P6A0BFMNWTWG technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Controllers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Package / Case:20-VFQFN Exposed Pad
- Current - Supply:10mA
- Interface:USB
- Supplier Device Package:20-QFN (4x4)
- Standards:USB 3.0
- Voltage - Supply:4.75V ~ 5.5V
- Protocol:USB
- Function:Adapter
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:OBSOLETE
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FUSB3307P6A0BFMNWTWG provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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